Multi-Divisional Engineering, Design, Analysis Lab-Wide Support

MEDALS is a multiple award, Indefinite Delivery Indefinite Quantity (IDIQ) contract that provides innovative solutions for JPL in support of non-flight and flight areas of engineering, technology development, hardware development, test development and operations support.

Discipline areas may include but are not limited to:

1.1    System Engineering Support: System requirements development; Interface development, tracking and documentation; System documentation development; Verification & Validation (V&V) Support including test support, test data analysis and test documentation; Mechanical and Electrical System Integration and Test support; Electrical systems engineering analysis support.
1.2    Electronics Design and Performance Analysis: Circuit design, Field Programmable Gate Array (FPGA) logic/circuit configuration and design, hybrid electronics assembly; performance analysis includes reliability analysis, electrical stress analysis, failure modes and effects analysis, and worst-case analysis.
1.3    Electronic Packaging Engineering: RF, high voltage and hybrid microelectronics packaging; printed wiring board design and printed circuit board fabrication; electronic chassis design; electronics assembly; electronic assembly design; thermal and structural analysis of electronic packages.
1.4    Mechanical Hardware Design and Engineering: Structure, deployment mechanisms and mechanical devices development; mechanical hardware test development and planning, test execution and/or support.
1.5    Structural Analysis: Finite element modeling, stress, loads, and dynamics analysis; structural test development and planning, structural test execution and/or support.
1.6    Thermal, Fluids, and Cryogenic Systems Engineering: Thermal hardware design and development; S/C Systems thermal analysis; Aerodynamic, aerothermodynamics and computational fluid dynamics analysis.
1.7    Propulsion Systems Engineering: Propulsion system design; component sizing and procurement support; integration and test support.
1.8    Cable/Harness Engineering: Harness design, fabrication and test support.
1.9    Materials and Materials Processes Engineering: Material review, analysis, test and technical documentation support.
1.10    Contamination Control Engineering: Contamination control management and contamination control analysis support.
1.11    Optical Systems Design and Analysis: Optical design, analysis, ray trace, and prescription development.
1.12    Opto-Mechanical Design and Development: Optical bench structure, optical component, filter wheel and focus mechanism design, fabrication, assembly and test. 
1.13    RF/Microwave Engineering: Design, assembly, test, and performance analysis.
1.14    Guidance Systems Engineering: Guidance system design, analysis and simulation; component sizing and procurement specification support; integration and test support.
1.15    Control Systems Engineering: Control system design, analysis and simulation; component sizing and procurement support; integration and test support.
1.16    Fabrication and Assemble: Build capability for flight and non-flight hardware; composite structures for spacecraft and instrument assemblies


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MEDALS Capabilities

Ball Aerospace provides technical services across a diverse customer base, including the Department of Defense, National Aeronautics and Space Administration, Intelligence Agencies, non-Defense agencies, and commercial customers.

DUNS Number: 085270270